Ersa Nitrogen Reflow Ovens: How to Improve Bubble/Void Reduction?
Solder voids (bubbles) are a common challenge in reflow soldering. While vacuum reflow ovens offer the most effective solution, significant improvements can be achieved through process optimization in nitrogen reflow ovens. This article shares practical adjustments that helped us reduce voiding rates from 20% down to 10%.
Why Nitrogen Matters
Adding nitrogen to the reflow oven improves solder fluidity and wettability. This creates a more favorable environment for flux activation and gas escape, laying the foundation for better void reduction — even without a vacuum system.
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Cleaning brush stainless steel, for example to clean wettable selective nozzles 213024 |
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Sealing 146054 |
